Compal introduced the much awaited Lid cooling technology for laptops. It’s a great step towards better laptop as today’s present method of using fan for cooling CPU is though effective but it also accumulates dust inside and also makes lots of noise. Dust is the major problem for all laptops around the world as total dust free environment is not possible and the fan inside the laptop sucks even more dust. Using fan also reduced battery backup. Lid cooling on the other hand is much better technology using heat pipe to transfer heat from CPU to the lid of the laptop. It’s like having a big heatsink. Using this technology for cooling will all manufacturers to make a completely sealed laptops which will not have any problem caused by dust and will have better battery backup.

This entry was posted on Friday, September 21st, 2007 at 4:27 pm and is filed under Technology. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.